Low pressure molding is rising in demand given its ability to provide superior protection to electronics components. Yet while all adhesives used in low pressure molding aid in seal integrity and part protection, smart polyamide adhesives offer further benefits:
With a low injection pressure level, polyamide low pressure molding solutions require less equipment and yield lower energy consumption as a result. Additionally, as a one-component product, they reduce cycle times and mixing error likelihood. This enables easier manufacturing with less downtime.
Enhance End-Use Products
Another benefit to using polyamide low pressure molding adhesives is their ability to enhance end-use products overall. Featuring delicate encapsulation, they are suitable for even the most sensitive electronic components and are lightweight. Water-tight and UL94 VO approved, these solutions are also resistant to:
- High temperatures
- Harsh environments
Furthermore, these solutions have a long shelf life and yield zero waste. Rather, the excess material is recyclable, which boosts sustainability levels. Solvent-free and up to 80% bio-based, these adhesives are also safe for workers and the environment.