Viva Las Vegas! Bostik is looking forward to attending Pack Expo again this year to showcase the latest in adhesive packaging innovations.
September 28th through the 30th, Bostik will be in Las Vegas for the largest processing and packaging event in the US. Pack Expo brings together managers, engineers, production professionals, package designers and brand managers from over forty markets to connect with top industry suppliers and gain perspective on the market. Pack Expo insiders state that Insights, Interaction, Inspiration and Innovation are among the top reasons to attend the show, and we couldn’t agree more.
Pack Expo provides hands-on training opportunities right on the show floor, an innovation stage focused on trends and technology, and a food safety resource center to address key issues on food safety. Additionally, the show provides a platform for top suppliers to showcase their newest technologies.
Bostik is excited to do just that! We are looking forward to launching our latest innovations, including adhesives for recycled board stock and a new general purpose hot melt, as well as the opportunity to educate the industry on M-Resins, our patented peelable and resealable adhesive that is revolutionizing multi-serve packaging.
Bostik thrives on our constant interaction with our customers, and having a prominent presence at Pack Expo will allow us the ideal opportunity to network. We are always eager to have personal one-on-one time with our customers. A convention like Pack Expo allows us to provide immediate answers to any questions they may have and do so much more personally and individualized than a website or brochure could. Pack Expo is where the customers are, and we are taking every opportunity to connect with them, to educate them, and to inform them about our products.
We encourage you to come interact with us! Let us inspire your next packaging advancements. Hear our market insights, and learn how Bostik’s latest innovations in smart adhesives can help you.