At this year’s PACK EXPO, Bostik will launch a new hot melt adhesive product for flexible packaging: Thermogrip 1955. Let’s take a closer look at the value this product brings to the market.
Bostik’s 1955 is an EVA-based hot melt adhesive. Designed for extrusion process applications, this product is ideal for lidding and individual containers. H1955 offers the following benefits to customers:
1955 has low heat activation temperature starting at 160°F. This is much lower than other hot melt adhesive products currently on the market. Additionally, this feature prevents burn-through and allows customers to use more cost effective or thin gauge materials, which provide cost savings.
Along with lower heat activation temperature, 1955 also offers consistent seal. This allows customers to run faster line speeds, increasing production efficiency.
Ease of Use
1955 offers excellent blocking resistant. This is important in self-would lamination rolls in particular, as it prevents two surfaces from sticking together. As a result, it allows for the film/substrate to be easily unwound without tearing or damaging the print.
1955 also offers superior adhesion to a variety of films including polypropylene, polyethylene and polyethylene terephthalate.
For more information on this new hot melt adhesive product, call 800-7-BOSTIK, or stop by Bostik’s booth at PACK EXPO: #E10707. Bostik will also feature its two new resealable adhesives for flexible packaging applications: JB018 and JB020.