Used in a range of industrial markets, tape can withstand harsh application demands and offers improved manufacturing processes. As a result, tapes are becoming an increasingly popular adhesive option.
Yet these tapes are arguably only as good as the adhesive used in their manufacturing. Take a look at a smart tape adhesive option and the various markets it benefits.
Smart Tape Adhesive Option
Bostik’s hot melt pressure sensitive adhesives, or HMPSAs, are a smart choice for tape application needs. Exhibiting excellent tack and peel as well, their formulations also enable adhesion on low surface energy materials.
Solvent-free and with low chemical emissions, these adhesives do more than improve worker safety during the manufacturing process. They also allow for faster set up times due to their rapid and precise application.
Smart Tape Adhesives in Automotive
Given Bostik’s HMPSAs’ capabilities, these smart tape adhesives work well in the automotive market. In particular, they are able to meet the following criteria, which are a necessity in this market:
- High performance levels
- Watertight seals
- Energy and vibration damping
Additionally, as a lightweight manufacturing option, tape adhesive helps the automotive OEMs meet fuel efficiency regulations.
Smart Tape Adhesives in Construction
Bostik’s HMPSAs also work well in the construction market. Designed to be strong, reliable and consistent, they are ideal for the following applications:
- Flashing tapes
- Drywall tapes
- Gaffer tapes
Additionally, our tape adhesives can be specially formulated for metal foil and foam tape carrier applications.
Smart Tape Adhesives in Medical
Bostik’s smart tape adhesives can also be formulated for medical applications. Achieving optimal performance, these HMPSAs are made from hypoallergenic materials and meet the highest level of sanitary standards. This makes them ideal for:
- Surgical drapes
- Incisive foils
- Wound care and fixation tapes
For more information on Bostik’s tape adhesives for various markets, visit www.bostik.com.