low pressure molding adhesives Tag Archive


August 3, 2021 - Assembly

Meet Your Goals with the Right Low Pressure Molding (LPM) Method

As the electronics market continues to evolve, offering more complex products comprised of increasingly delicate parts, it’s a good idea to assess your encapsulation processes for circuit boards and cable assembly to ensure they are best suited to keep up with key needs. In particular, if you are currently using the traditional potting process, you …

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October 17, 2019 - Assembly

3 Ways the Right Low Pressure Molding Adhesive Helps Your Company

Expected to grow at 6.13% through 2022, low pressure molding is rising in demand given its ability to provide superior protection to electronics components. Yet while all adhesives used in low pressure molding aid in seal integrity and part protection, smart polyamide adhesives offer further benefits: Improve Processes With a low injection pressure level, polyamide …

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